Part number:
XCVC1702-1MLINSVG1369
System On Chip (SoC)
Manufacturer:
Xilinx (AMD)
IC VERSAL AI-CORE FPGA 1369BGA
Tray
RoHS:
YES
XCVC1702-1MLINSVG1369
: 1
: 1
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$50,522.5000
$50,522.5000
XCVC1702-1MLINSVG1369
PDF1
| TYPE | DESCRIPTION |
| Mfr | Xilinx (AMD) |
| Series | Versal™ AI Core |
| Package | Tray |
| Product Status | ACTIVE |
| Package / Case | 1369-BFBGA, FCBGA |
| Speed | 600MHz, 1.3GHz |
| RAM Size | 256KB |
| Number of I/O | 500 |
| Operating Temperature | -40°C ~ 110°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 1369-FCBGA (35x35) |
| Architecture | MPU, FPGA |
